Stiffeners
Constructed For Demanding Dynamic Load
And Critical Thermal Resilience.
Stiffeners
Crucial Mechanical Support for Wafer Probe Card Testing
- Engineered to ensures probe cards stay flat during testing, preventing misalignment and false failures.
- Meticulously designed to reduce thermal-related errors increases testing reliability across extreme temperatures (-55°C to 150°C).
- Maximizes space for mounting load boards, test electronics and supports complex probe card designs.
Samples
Unique Selling Points
Stiffeners
Providing Stability In Chip Probing
Mechanical Stability Under Cyclic Loads
Withstands millions of high-force touchdowns (>50N) without fatigue, preventing probe card deformation.
Unmatched Flatness Under Load
Maintains <5µm deviation across 6“ – 12″ wafers, ensuring consistent pad-to-pad needle contact.
Active Vibration Damping
Reduces high-frequency oscillations by >60% during high-speed probing, minimizing signal noise.
Tri-Temp Stability
Limited warping from -55 °C to 150 °C to avoid repeated re-calibration.
Advance Materials
Titanium/ceramic construction outlasts standard materials, even in harsh environments.
Products In Related Capabilities
Wafer Probe & Sampling
Back-End Semiconductor Solutions
Back-End Semiconductor Solutions
Wafer Probe & Sampling
Wafer Test Probe Heads
Probe cards
Stiffeners
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Through a unique combination of engineering, construction and design disciplines and expertise.