Stiffeners

Crucial Mechanical Support for Wafer Probe Card Testing

Our design is optimized for integration with industry-standard probe card architectures.

Engineered to ensures probe cards stay flat during testing, preventing misalignment and false failures.
Meticulously designed to reduce thermal-related errors increases testing reliability across extreme temperatures (-55°C to 150°C).
Maximizes space for mounting load boards, test electronics and supports complex probe card designs.

Withstands millions of high-force touchdowns (>50N) without fatigue, preventing probe card deformation.

Maintains <5µm deviation across 6“ – 12″ wafers, ensuring consistent pad-to-pad needle contact.

Reduces high-frequency oscillations by >60% during high-speed probing, minimizing signal noise.

Limited warping from -55 °C to 150 °C to avoid repeated re-calibration.

Titanium/ceramic construction outlasts standard materials, even in harsh environments.

Through a unique combination of engineering, construction and design disciplines and expertise.