Probe Heads

Attain Consistency Across Every Wafer Testing

Our probe heads aids reliable test performance in race towards smaller nodes and heterogenous integration.

Using laser-calibrated probes and ultra-hard materials to produce higher parallelism for nodes up to 5nm.
Stability under heat delivers accurate validation result for high speed test essential for RF applications.
Automated calibration and testing enabled fabrication of multi-sites probe heads for parallel testing with identical accuracy.

Laser-aligned bonding achieve tight ±3µm planarity reduces site-specific misalignment errors.

100% Automated Optical Inspection (AOI) ensures consistent tip-to-tip variation to land all probes simultaneously,

Low-CTE ceramics minimize warpages at temperature and add strength for high-speed probing.

Tightly controlled design, fabrication, and validation process assures uniformity in geometry across sites.

Strategic substrate material selection matched with alloyed probe tip reduces wear to extends touchdowns cycles.

Through a unique combination of engineering, construction and design disciplines and expertise.