Singulation Saw

Singulation Saw

Versatility To Handle Molded Leadframe Arrays Of All Densities

High-rigidity tool frame maintains stability when cutting varying leadframe arrays.

Guides dicing saws onto dicing streets accurately in dense arrays, ensuring high-yield, burr-free singulation at lower cost per unit.

Continuous design improvement optimize cutting performance by reducing mechanical stress and minimizing micro-cracks.

Tailored rubber hardness matching to leadframe thickness aids vibration damping to prevents mechanical damage.

Hardened coatings on tool interfaces minimize pick-and-place abrasion to extend tool life and maintain positional stability.

Multi-axis CNC grinding and precision wire EDM enable fabrication of intricate undercuts, thin walls, and tight-tolerance contours.

Ball Mount Tools

Maximizing Solder Sphere Mass Transfer Efficiency
To High Density BGA Pads

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Through a unique combination of engineering, construction and design disciplines and expertise.

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