Ball Mount Tools
Maximizing Solder Sphere Mass Transfer Efficiency
To High Density BGA Pads.
Ball Mount Tools
Simultaneously Transfer Thousands Of Solder Spheres With High Placement Accuracy
Our solder ball tool combines automated flux dipping, precision template alignment and mass-transfer deposition of complete solder sphere arrays onto BGA pads down to 0.2mm pitch requirements.
- Intelligence system selects optimal pin geometry based on pad pitch and dimension, and computes dipping height to maintain flux volume consistency, reducing non-wetting and bridging defects.
- Template tool mirrors BGA layout to fit exactly for effective solder sphere capture. Wear-resistant surfaces prevent ball abrasion to extend service life.
- A hierarchically distributed multi-zoned network regulates vacuum pressure uniformity across the thousands of pickup nozzles for reliable mass transfer.
Ball Mount Tools
Constructed To Fit Exactly Onto BGA Layouts Ensuring Precise Solder Ball-to-Pad Alignment For High I/O Assembly
Proven Capability To Meet Industry Tight Placement Accuracy For Fine-Pitch BGA
Ultra-precise drilling equipment achieves uniformity throughout transfer tool maintaining tight tolerance for demanding uBGA’s pitch
Mass Transfer Up To 92,000 Balls To Realize High Throughput Production
Specialized micro-drilling using toughened carbide bits achieves ±2μm hole tolerance critical to supporting high density leadframe packages.
Repeatable Flux Deposit Volume
Accurate pin tool geometry enables uniform flux deposition to prevent bridging and non-wet defects in mass production.
Down to 0.10mm ball diameter and up to 10k interconnects
Fully automated drilling with active cooling maintains ±2μm hole tolerance ensuring precise nozzle plate fabrication for high density and high accuracy ball placement.
Advance MaterialsMillions Of Cycles Without Impacting Performance
Hardened coatings on tool interfaces minimize solder ball abrasion to extend tool life and maintain pocket dimensional stability.
Hardened coatings on tool interfaces minimize solder ball abrasion to extend tool life and maintain pocket dimensional stability.
Multi-axis CNC grinding and specialized drilling enable intricate fabrication of vacuum network to maintain suction uniformity across pickup nozzles.
Ball Mount Tools
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Through a unique combination of engineering, construction and design disciplines and expertise.